WAVEPIA has undertaken a range of research initiatives with the aim of enhancing the performance of its in-house designed devices and boosting production yield, resulting in the acquisition of numerous related patents. Some of these patented technologies are indeed incorporated into our final products.

One-PKG
(Patent | Matched Transistor)

WAVEPIA employs 'One-PKG' technology for Matched Transistor lineup. This approach involves performing matching on a separate small board, eliminating the need for additional wire bonding. As a result, it enhances RF performance, reduces package costs, boosts productivity, and, most importantly, minimizes performance loss by reducing the number of wire bonds.

Reliability Monitoring
(Patent | Bare die)

In GaN solutions, temperature management usually relies on a separate sensor, which can introduce errors and take up additional space. WAVEPIA’s GaN-on-SiC chip features an integrated temperature monitoring function at the chip level, enhancing accuracy and conserving space.

WBL
​​​​​​​(Patent | Unmatched Transistor)

WAVEPIA’s WBL (Wire-bonding-less) technology employs clip bonding technology in the production process. This replaces the traditional wire-bonding method used for connecting the die and package input/output stages in an unmatched transistor. The benefits of this approach include enhanced reliability and productivity. Furthermore, it can be utilized in solutions operating in higher frequency bands.

ADA
​​​​​​​(Unique Equipment)

WAVEPIA’s Automatic Die Attach equipment is specifically designed to facilitate the efficient and rapid attachment of dies to packages. This equipment enables tasks to be completed more swiftly and effectively under the supervision of a single individual. Moreover, it minimizes the voids between the die and package, thereby enhancing the overall reliability of the RF devices.