WAVEPIA has undertaken a range of research initiatives with the aim of enhancing the performance of its in-house designed devices and boosting production yield, resulting in the acquisition of numerous related patents. Some of these patented technologies are indeed incorporated into our final products.

One-PKG
(Patent | Matched Transistor)

VEPIA's Matched Transistor uses a technology called One-PKG. Matching is done on a separate small board, enabling RF performance without separate wire bonding. This has the advantage of reducing package cost, increasing productivity, and most importantly, minimizing performance loss by minimizing the number of wire-bondings.

Reliability Monitoring
(Patent | Bare die)

Temperature management in GaN solutions is typically done with a separate sensor, leading to errors and space issues. WAVEPIA’s GaN-on-SiC chip integrates a temperature monitoring function, improving accuracy and saving space.

WBL
​​​​​​​(Patent | Unmatched Transistor)

WAVEPIA’s WBL (Wire-bonding-less) technology employs clip bonding technology in the production process. This replaces the traditional wire-bonding method used for connecting the die and package input/output stages in an unmatched transistor. The benefits of this approach include enhanced reliability and productivity. Furthermore, it can be utilized in solutions operating in higher frequency bands.

ADA
​​​​​​​(Unique Equipment)

WAVEPIA’s Automatic Die Attach equipment is specifically designed to facilitate the efficient and rapid attachment of dies to packages. This equipment enables tasks to be completed more swiftly and effectively under the supervision of a single individual. Moreover, it minimizes the voids between the die and package, thereby enhancing the overall reliability of the RF devices.