WAVEPIA offers a wide range of packaging solutions, enhancing product value by integrating exclusive patented technologies for packaging. The performance of the device are continually optimized through the ongoing evolution of these packaging solutions. WAVEPIA is dedicated to the ongoing exploration of new packaging solutions to broaden the selection available to its customers.

Unmatched Transistor : 360BH(S)

360BH(S) packages are applied for WAVEPIA's unmatched transistors with smaller sized devices with relatively lower output power. 

Unmatched Transistor : 580BH(S)

580BH(S) packages are applied for WAVEPIA's unmatched transistors with relatively larger and higher output power solution. 

Unmatched Transistor : others

Matched Transistor : One-PKG

WAVEPIA provides a solution matched to 50 ohms as well. The application of WAVEPIA’s distinctive packaging technology, known as ONE-Package, aids in enhancing performance and boosting productivity.

MMIC : MPKG2

MPKG2 is the ceramic package most commonly used for WAVEPIA's MMIC devices. It is mainly applied to products up to the X-band band.

MMIC : MPKG3.1

MPKG3.1 is a derived version of MPKG2 primarily designed for solutions above X-band for MMIC devices. It has a slightly smaller footprint compared to MPKG2.

MMIC : Carrier Type PKG (leadless)

The carrier type package is an alternative form of MMIC device packaging designed for certain system types. Being leadless, it reduces the distance between the device and the input/output stage, leading to a more compact space requirement, decreased performance loss, and enhanced heat dissipation upwards where the device lid is open.

The Quad Flat No-lead (QFN) package is a compact, cost-effective semiconductor package widely used in RF devices due to its excellent electrical and thermal performance. It’s a lead frame-based package that employs surface-mount technology to connect the silicon die to a printed circuit board, making it ideal for high-frequency applications.